Title:
Cu-Ni-Si合金すずめっき条の製造方法
Document Type and Number:
Japanese Patent JP4986499
Kind Code:
B2
Abstract:
In a Sn-plated strip in which a copper base alloy contains 1.0 to 4.5 mass % of Ni, 0.2 to 1.0 mass % of Si and a balance of Cu and unavoidable impurities, an S concentration and a C concentration in a boundary between a plating layer and the base alloy are adjusted to 0.05 mass % or less, respectively. The base alloy may further contain 0.005 to 3.0 mass % in total of at least one selected from the group consisting of Sn, Zn, Mg, Fe, Mn, Co, Ti, Cr, Zr, Al and Ag. There is provided a Cu-Ni-Si base alloy Sn-plated strip in which the resistance to thermal peel of Sn plating has been improved.
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Inventors:
Takatsugu Hatano
Application Number:
JP2006121848A
Publication Date:
July 25, 2012
Filing Date:
April 26, 2006
Export Citation:
Assignee:
jx Nippon Mining & Metals Co., Ltd.
International Classes:
C22C9/06; B21B3/00; C22C9/00; C22C9/01; C22C9/02; C22C9/04; C22C9/05; C22F1/08; C25D7/00; H01H1/025; H01H1/04; H01R13/03; C22F1/00; H01B5/02
Domestic Patent References:
| JP2005350774A | ||||
| JP3223482A | ||||
| JP2004068026A | ||||
| JP2000169996A | ||||
| JP5059468A | ||||
| JP2004300524A | ||||
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| JP2005105419A | ||||
| JP2002317295A | ||||
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| JP2007092173A |
Attorney, Agent or Firm:
Axis International Patent Business Corporation
Motohiro Kurauchi
Endo Azusa
Takumi Yoshida
Taku Nakajima
Motohiro Kurauchi
Endo Azusa
Takumi Yoshida
Taku Nakajima