Title:
貼り合わせSOIウェーハの製造方法
Document Type and Number:
Japanese Patent JP4802624
Kind Code:
B2
More Like This:
Inventors:
Isao Yokokawa
Nobuhiko Noto
Nobuhiko Noto
Application Number:
JP2005259759A
Publication Date:
October 26, 2011
Filing Date:
September 07, 2005
Export Citation:
Assignee:
Shin-Etsu Semiconductor Co., Ltd.
International Classes:
H01L27/12; H01L21/02
Domestic Patent References:
| JP2000331899A | ||||
| JP2003068593A |
Attorney, Agent or Firm:
Mikio Yoshimiya