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Title:
セラミック基板、薄膜回路基板およびセラミック基板の製造方法
Document Type and Number:
Japanese Patent JP4795529
Kind Code:
B2
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Inventors:
Yasushi Godai
Application Number:
JP2000373122A
Publication Date:
October 19, 2011
Filing Date:
December 07, 2000
Export Citation:
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Assignee:
Toshiba Corporation
Toshiba Materials Co., Ltd.
International Classes:
C04B35/584; B24B7/17; C04B35/00; C04B35/581; C04B41/91; H05K1/03; H05K3/00
Domestic Patent References:
JP4261768A
JP11188588A
JP2000086346A
JP2000053470A
JP8048564A
Foreign References:
WO2000067950A1
Attorney, Agent or Firm:
Hisashi Hatano
Shunguchi Sekiguchi



 
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