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Title:
MANUFACTURING METHOD FOR CHANNEL SUBSTRATE, MANUFACTURING METHOD FOR LIQUID DROPLET EJECTION HEAD AND MANUFACTURING METHOD FOR LIQUID DROPLET EJECTOR
Document Type and Number:
Japanese Patent JP2008273001
Kind Code:
A
Abstract:

To provide a manufacturing method for a channel substrate in which nozzles can be highly precisely machined and formed to a silicon substrate to be the channel substrate while a reservoir capacity sufficient for prevention of cross talk is secured, and to provide a manufacturing method for a liquid droplet ejection head, and a manufacturing method for a liquid droplet ejector.

In the manufacturing method for the channel substrate 1, a liquid channel comprised of a nozzle hole 11, a cavity 12 and a reservoir 13 with a predetermined capacity is formed to a channel substrate base material consisting of a single silicon substrate. When part for forming the nozzle hole 11, cavity 12 and reservoir 13 is etched from one surface of the channel substrate base material to a predetermined depth, a through-hole part for alignment penetrating the channel substrate base material is formed simultaneously. After the nozzle hole is etched to the predetermined depth, the channel substrate base material is aligned, and the nozzle hole is made to pierce from the other surface of the channel substrate base material.


Inventors:
ARAKAWA KATSUHARU
OTANI KAZUFUMI
Application Number:
JP2007118107A
Publication Date:
November 13, 2008
Filing Date:
April 27, 2007
Export Citation:
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Assignee:
SEIKO EPSON CORP
International Classes:
B41J2/16; B41J2/045; B41J2/055; B41J2/135
Domestic Patent References:
JPH1128820A1999-02-02
JPH0957981A1997-03-04
Attorney, Agent or Firm:
Hisao Kobayashi
Kiyoshi Yasushima
Souji Sasaki
Noboru Omura
Takanashi Norio