Title:
回路接続材料、回路部材の接続構造及び回路部材の接続構造の製造方法
Document Type and Number:
Japanese Patent JP5018779
Kind Code:
B2
Abstract:
The present invention provides a circuit connecting material for electrically connecting a first circuit member having a first circuit electrode formed on a major surface of a first circuit substrate, and a second circuit member having a second circuit electrode formed on a major surface of a second circuit substrate, with the first and the second circuit electrodes opposed to each other, comprising an adhesive component containing a fluorine-containing organic compound, wherein the adhesive component contains 0.10% or less by mass of a silicon-containing compound, in terms of silicon atoms, based on the total amount of the adhesive component.
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Inventors:
Yasuhiro Arifu
Mochizuki Hiomi
Koji Kobayashi
Takashi Nakazawa
Takashi Tachizawa
Katsuyuki Masuda
Takako Ejiri
Mochizuki Hiomi
Koji Kobayashi
Takashi Nakazawa
Takashi Tachizawa
Katsuyuki Masuda
Takako Ejiri
Application Number:
JP2008530900A
Publication Date:
September 05, 2012
Filing Date:
August 20, 2007
Export Citation:
Assignee:
Hitachi Chemical Co., Ltd.
International Classes:
H05K1/14; C09J4/02; C09J5/00; C09J9/02; C09J11/06; C09J11/08; C09J179/08; C09J183/04; C09J201/00; H05K3/32
Domestic Patent References:
| JP2005089678A | 2005-04-07 | |||
| JP2005120269A | 2005-05-12 | |||
| JP2006002035A | 2006-01-05 | |||
| JPH05279649A | 1993-10-26 | |||
| JPH10102025A | 1998-04-21 | |||
| JP2002371260A | 2002-12-26 | |||
| JP2004051970A | 2004-02-19 | |||
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| JP2001049228A | 2001-02-20 | |||
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| JP2005054140A | 2005-03-03 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Yoshinori Shimizu