部品実装装置および実装基板の製造方法

Title:

部品実装装置および実装基板の製造方法

Document Type and Number:

Japanese Patent JP7001885

Kind Code:

B2

Abstract:

A component mounting device and a method of manufacturing a mounting substrate are provided. The component mounting device (1) includes a component mounting unit (40) that mounts the component (D) toan object (W) of the mounting component; a reversing unit (an arm unit (51), and a unit rotation mechanism (52)), which allows the object (W) on which the component (D) is mounted to be integrally inverted with the component (D); a transfer unit (a third substrate transfer mechanism (82C)) which transfers the reversed object (W) to a component pressure welding portion (60); and the component pressure welding portion (60) which performs pressure welding on the component (D) to the object (W) on which the component (D) is mounted.

Inventors:

Akira Kameda
Satoshi Adachi
Ryuji Hamada

Application Number:

JP2017174555A

Publication Date:

January 20, 2022

Filing Date:

September 12, 2017

Export Citation:

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