To provide a method capable of manufacturing conductive electroless plating powder, in which foreign matters are not mixed and which is excellent in plating adhesiveness, without using chromic acid, permanganic acid or the like causing environmental pollution.

In the method for manufacturing conductive electroless plating powder, the surface of core powder is hydrophilized by using the photocatalytic effect of semiconductor compounds, and a metallic film is deposited by the electroless plating on the surface of the hydrophilized core powder. Hydrophylization is performed by irradiating the light on a covering layer 5 while a member 6 having the covering layer 5 including the semiconductor compounds on a surface of a base material 4 is immersed in liquid with the core powder being suspended.