Title:
Manufacturing method of copper-clad laminate
Document Type and Number:
Japanese Patent JP6342239
Kind Code:
B2
Abstract:
The present invention relates to a method for manufacturing a copper clad laminate, which raises the glass transition temperature (Tg) and stiffness by rehardening at a high temperature after laminating and hardening at a high temperature or primarily laminating and hardening a prepreg manufactured by adding a maleimide-based resin or a cyanate-based resin to a varnish which uses an existing epoxy-based resin as a main raw material with a copper foil.
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Inventors:
Han Yong Kyu
Lee Dong Kun
Lee San Ze
Lee Dong Kun
Lee San Ze
Application Number:
JP2014139389A
Publication Date:
June 13, 2018
Filing Date:
July 07, 2014
Export Citation:
Assignee:
Samsung Electro-Mechanics Co., Ltd.
International Classes:
B32B15/08; C08G59/40; C08J5/04; H05K1/03
Domestic Patent References:
| JP2014024925A | ||||
| JP2014024926A | ||||
| JP2006131743A | ||||
| JP2007204697A | ||||
| JP2009094217A | ||||
| JP2286711A | ||||
| JP63145022A |
Foreign References:
| WO2012165423A1 | ||||
| CN102174242A |
Attorney, Agent or Firm:
Konobu Kato
Fukukawa Shinya
Fukukawa Shinya