Title:
キャリア付銅箔、プリント配線板、銅張積層板、電子機器、キャリア付銅箔の製造方法、及び、プリント配線板の製造方法
Document Type and Number:
Japanese Patent JP6649001
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a copper foil with a carrier, with the occurrence of a copper residue larger than the circuit width of a specified circuit well inhibited, the circuit being formed on an ultrathin copper layer after detachment of a carrier laminated on a resin substrate for removal.SOLUTION: A copper foil with a carrier includes a carrier, an intermediate layer, and an ultrathin copper layer in this order. The surface of the carrier on the side of the ultrathin copper layer has stripe-like projections having an average height of 2.0 μm or less at a maximum.
Inventors:
Nobuaki Miyamoto
Yuta Nagaura
Shinichi Sasaki
Tomoki Kobiki
Yuta Nagaura
Shinichi Sasaki
Tomoki Kobiki
Application Number:
JP2015144454A
Publication Date:
February 19, 2020
Filing Date:
July 21, 2015
Export Citation:
Assignee:
JX Nippon Mining & Metals Co., Ltd.
International Classes:
C25D7/06; B32B3/30; B32B15/04; C23F1/18; C25D1/04; C25D5/10; H05K1/09; H05K3/00; H05K3/38
Domestic Patent References:
| JP2000269637A | ||||
| JP2001073188A | ||||
| JP10330984A |
Attorney, Agent or Firm:
Axis International Patent Business Corporation