Title:
MANUFACTURING METHOD OF DISPLAY DEVICE
Document Type and Number:
Japanese Patent JP2016167615
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide: a peeling method that does not damage a peeled layer, by which not only a peeled layer having a small area can be peeled, but also a peeled layer having a large area can be peeled over the whole surface with high yield; a semiconductor device, in which a peeled layer is attached to various base materials and light weight is achieved, and a manufacturing method thereof; and a semiconductor device, in which specifically various elements represented by a TFT are attached to a flexible film and light weight is achieved, and a manufacturing method thereof.SOLUTION: Even though a first material layer 11 is provided on a substrate, a second material layer 12 is provided in contact with the first material layer 11, and deposition by lamination or a heat treatment at 500°C and above and irradiation treatment by laser beams are further performed, a peeled layer can be easily and cleanly separated by physical means at a position in the layer or an interface of the second material layer 12 as long as the first material layer before peeling has a tensile stress and the second material layer has a compression stress.SELECTED DRAWING: Figure 1
Inventors:
TAKAYAMA TORU
MARUYAMA JUNYA
YAMAZAKI SHUNPEI
MARUYAMA JUNYA
YAMAZAKI SHUNPEI
Application Number:
JP2016084649A
Publication Date:
September 15, 2016
Filing Date:
April 20, 2016
Export Citation:
Assignee:
SEMICONDUCTOR ENERGY LAB CO LTD
International Classes:
H01L21/02; H01L29/786; H01L21/20; H01L21/336; H01L21/762; H01L21/77; H01L21/84; H01L27/12
Domestic Patent References:
| JPH11243209A | 1999-09-07 | |||
| JP2000299469A | 2000-10-24 |
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