To provide an electronic component package manufacturing method which materializes highly precision manufacture of an electronic component package, then, meets the need for miniaturization of the electronic components.

A brazing filler metal 52 is arranged in a metallization region formed in an electronic component package main body 50 and a lid fixing ring 54 is arranged on the brazing filler metal 52. Further, a part of the lid fixing ring 54 is spot-heated to partially melt the brazing filler metal 52, and the lid fixing ring 54 is temporarily fixed to the metallization region. Thereafter, the electronic component package main body is heated to totally melt the brazing filler metal 52, and the lid fixing ring 54 is fixed to the metallization region.