WAFER SURFACE PROTECTIVE TAPE, AND WAFER GRINDING METHOD

Title:

WAFER SURFACE PROTECTIVE TAPE, AND WAFER GRINDING METHOD

Document Type and Number:

Japanese Patent JP2009016538

Kind Code:

A

Abstract:

To provide a wafer surface protective tape capable of being excellently peeled from a wafer surface without causing peeling defects or the chipping or cracking of a wafer or the like, since the sensor recognition property of the sensor recognition part of the wafer in a peeling process is excellent, positioning defects or the like are hardly caused and adhesion of a base material film back surface to a peeling tape is high.

The wafer surface protective tape 10 is used in the process of sticking the surface side of a base material film to the surface of the wafer provided with the sensor recognition part and grinding the back surface of the wafer. The back surface of the base material film has a coarse region 20 where center line average roughness (Ra) is 1-9 m and flat regions 22 and 24 where the center line average roughness (Ra) is 0.5 m.

Inventors:

WATANABE KENSAKU
YOKOI HIROTOKI

Application Number:

JP2007176160A

Publication Date:

January 22, 2009

Filing Date:

July 04, 2007

Export Citation:

Click for automatic bibliography generation Help

Assignee:

FURUKAWA ELECTRIC CO LTD

International Classes:

H01L21/304; C09J7/02; H01L21/683

Domestic Patent References:

JP2005239889A	2005-09-08
JP2006186305A	2006-07-13
JP2006056995A	2006-03-02
JP2007146104A	2007-06-14

Attorney, Agent or Firm:

Shunsuke Nakao
Takashi Ito
Yoshimi Hatanaka
Naoko Okura
Fumari Tamari
Takeyuki Suzuki
Shiro Isoda
Yohei Takahashi

Previous Patent: MANUFACTURING METHOD OF ELECTRONIC COMPONENT PACKAGE

Next Patent: PLASMA PROCESSING EQUIPMENT AND PLASMA PROCESSING METHOD