Title:
電子装置の製造方法
Document Type and Number:
Japanese Patent JP6784053
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide: an electronic device which enables the increase in the reliability of connection with a circuit board; and a method for manufacturing the electronic device.SOLUTION: A method for manufacturing an electronic device comprises the steps of: putting a bump 13 on a metal layer 7 including at least one of gold, palladium, and nickel that an electronic component 1 includes; and connecting the bump 13 to the metal layer 7 by heating and melting the bump 13. The bump 13 includes at least one element of 0.05-1 wt% of gold, 0.05-1 wt% of palladium and 0.5-2 wt% of nickel, tin more than the at least one element in concentration by mass%, and bismuth larger than the at least one element in concentration by mass%.SELECTED DRAWING: Figure 10
Inventors:
Kozo Shimizu
Seiki Sakuyama
Seiki Sakuyama
Application Number:
JP2016084293A
Publication Date:
November 11, 2020
Filing Date:
April 20, 2016
Export Citation:
Assignee:
富士通株式会社
International Classes:
H05K3/34; B23K35/26; H01L23/12
Domestic Patent References:
| JP2010129664A | ||||
| JP2008098212A | ||||
| JP11033775A | ||||
| JP2000190090A | ||||
| JP2004034134A | ||||
| JP2013163207A | ||||
| JP2009155668A |
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Tadahiko Ito