Title:
MANUFACTURING METHOD FOR LAMINATED CERAMIC ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP3956703
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To solve the problem that bleeding due to a conductive paste may occur around a through hole since minute irregularities are generated in a ceramic green sheet due to the thickness of a conductor film, when the conductive paste is to be filled into the through hole by a screen print method as a via hole conductor is formed after the conductor film is formed, and deformation in a screen plate cannot follow the minute irregularities in a manufacturing method of a laminated type ceramic electronic component.
SOLUTION: Between a process for forming a conductor film 12 and a process for filling a conductive paste 23 into a through hole 13 to form a via hole conductor 14, a process for pressing a ceramic green sheet 11 in a thickness direction is performed by a pair of rollers 31 and 32 or the like.
Inventors:
Yoshikazu Oikawa
Akihiko Kamata
Norio Sakai
Akihiko Kamata
Norio Sakai
Application Number:
JP2002000629A
Publication Date:
August 08, 2007
Filing Date:
January 07, 2002
Export Citation:
Assignee:
MURATA MANUFACTURING CO.,LTD.
International Classes:
H01G4/30; H05K3/46; H05K1/11; H05K3/40; (IPC1-7): H05K3/46; H01G4/30; H05K1/11; H05K3/40
Domestic Patent References:
| JP1027959A | ||||
| JP5191048A | ||||
| JP5145236A |
Attorney, Agent or Firm:
Masaaki Koshiba
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