積層型モジュールの製造方法

Title:

積層型モジュールの製造方法

Document Type and Number:

Japanese Patent JP4145804

Kind Code:

B2

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Inventors:

Katsuhiko Horimei
Hiroshi Koike
Kanai Michio

Application Number:

JP2004000608A

Publication Date:

September 03, 2008

Filing Date:

January 05, 2004

Export Citation:

Assignee:

LINTEC CORPORATION

International Classes:

H01L23/28; H01L25/10; H01L21/56; H01L25/11; H01L25/18

Domestic Patent References:

JP2003501805A
JP2001250836A

Attorney, Agent or Firm:

Shunichiro Suzuki
Koji Makimura
Chihata Takahata
Toru Suzuki

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