Title:
MANUFACTURING METHOD OF MULTILAYER CERAMIC ELECTRONIC COMPONENT
Document Type and Number:
Japanese Patent JP2018098247
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a manufacturing method of a multilayer ceramic electronic component having an excellent cutting side surface.SOLUTION: A manufacturing method of a multilayer ceramic electronic component, comprises steps of: manufacturing a mother block including a plurality of laminated ceramic green sheets and an inner electrode pattern arranged along a plurality of boundary surfaces between the ceramic green sheets; acquiring a plurality of green chips that includes a lamination structure constructed by having a plurality of ceramic layers in a raw state and a plurality of inner electrodes by cutting the mother block along first and second direction cutting-plane lines orthogonal each other, and in which each inner electrode exposes to a cutting side surface appeared by the cutting along the first direction cutting-plate line; eliminating a metal component of the cutting side surface; performing a cutting processing by using a bite to the cutting side surface; acquiring a raw component main body by forming a raw ceramic protection layer in the cutting side surface after the cutting processing; and burning the raw component body.SELECTED DRAWING: Figure 9
Inventors:
FUJITA AKIRA
TAKAGI YUYA
MATSUI TOGO
TAKAGI YUYA
MATSUI TOGO
Application Number:
JP2016238523A
Publication Date:
June 21, 2018
Filing Date:
December 08, 2016
Export Citation:
Assignee:
MURATA MANUFACTURING CO
International Classes:
H01G13/00; H01G4/12; H01G4/30
Domestic Patent References:
| JP2017120880A | 2017-07-06 | |||
| JP2012209539A | 2012-10-25 | |||
| JP2012209538A | 2012-10-25 |
Attorney, Agent or Firm:
Atomi International Patent Office