Title:
MANUFACTURING METHOD OF PACKAGE COMPONENT AND PACKAGE COMPONENT
Document Type and Number:
Japanese Patent JP2011243596
Kind Code:
A
Abstract:
To provide a manufacturing method of a package component, which can improve package quality.
Semiconductor chips 2, which are functional components, are mounted on a mounting surface of a substrate 1a. Next, each semiconductor chip 2 is sealed by an encapsulation resin 3. Subsequently, polishing is performed from a surface of the encapsulation resin 3 opposite to a surface facing to the mounting surface of the substrate 1a, to polish the encapsulation resin 3 and each semiconductor chip.
Inventors:
AZUMA KAZUJI
Application Number:
JP2010111582A
Publication Date:
December 01, 2011
Filing Date:
May 14, 2010
Export Citation:
Assignee:
PANASONIC CORP
International Classes:
H01L25/065; H01L23/12; H01L23/29; H01L23/31; H01L25/07; H01L25/18
Attorney, Agent or Firm:
Yohei Harada
Yoshihiro Morimoto
Yoshihiro Morimoto
Previous Patent: PLASMA ASHING METHOD AND PLASMA ASHING APPARATUS
Next Patent: MATERIAL FOR ORGANIC ELECTROLUMINESCENT ELEMENT AND ITS USE
Next Patent: MATERIAL FOR ORGANIC ELECTROLUMINESCENT ELEMENT AND ITS USE