Title:
MANUFACTURING METHOD OF PIEZOELECTRIC DEVICE, PIEZOELECTRIC DEVICE, PIEZOELECTRIC MODULE AND ELECTRONIC APPARATUS
Document Type and Number:
Japanese Patent JP2016225420
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a manufacturing method of a piezoelectric device having desired performance, and the piezoelectric device, an ultrasonic device, a piezoelectric module and an electronic apparatus.SOLUTION: An ultrasonic device (piezoelectric device) comprises: a substrate including a device substrate 10 and a diaphragm 20; first piezoelectric elements 30 provided on the substrate; a first protection film 40 provided on the first piezoelectric elements 30 and the substrate; and second piezoelectric elements 50 provided on the first protection film 40. The ultrasonic device is manufactured by forming the first piezoelectric elements 30 on the substrate, forming the first protection film 40 on the first piezoelectric elements 30 and the substrate, and forming the second piezoelectric elements 50 on the first protection film 40.SELECTED DRAWING: Figure 2
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Inventors:
SUGIURA MASANORI
Application Number:
JP2015108947A
Publication Date:
December 28, 2016
Filing Date:
May 28, 2015
Export Citation:
Assignee:
SEIKO EPSON CORP
International Classes:
H01L41/23; H01L41/053; H01L41/09; H01L41/113; H01L41/29; H01L41/319; H01L41/332; H01L41/43; H04R17/00; H04R31/00
Attorney, Agent or Firm:
Intellectual Property Office