Title:
多孔性銅箔の製造方法及びこれを用いた多孔性銅箔
Document Type and Number:
Japanese Patent JP6545854
Kind Code:
B2
Abstract:
Provided is a method for producing a porous copper foil. The method includes forming a release layer on a metal carrier, growing copper islands on the metal carrier formed with the release layer by electroless copper plating, forming a porous copper thin layer by copper electroplating, and peeling off the porous copper thin layer from the release layer.
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Inventors:
John, Song Wook
Kim, iku bomb
John, Song Gi
Lee, Defun
Kang, Yun Bon
Hong, Junmo
Park, Hyun Gyu
Kim, iku bomb
John, Song Gi
Lee, Defun
Kang, Yun Bon
Hong, Junmo
Park, Hyun Gyu
Application Number:
JP2018058059A
Publication Date:
July 17, 2019
Filing Date:
March 26, 2018
Export Citation:
Assignee:
YMT Company Limited
International Classes:
C25D1/08; B32B5/22; B32B15/01; C25D1/04; C25D1/22
Domestic Patent References:
| JP2010132959A | ||||
| JP10237664A | ||||
| JP2004169181A | ||||
| JP5063334A | ||||
| JP3262558B2 | ||||
| JP56081694A | ||||
| JP2007242975A |
Foreign References:
| KR1020160116288A | ||||
| US20130143071 |
Attorney, Agent or Firm:
Atsushi Nakajima
Kato Kazunori
Kato Kazunori