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Patent Searching and Data


Title:
METHOD FOR MANUFACTURING DEPOSITION MASK, AND DEPOSITION MASK
Document Type and Number:
WIPO Patent Application WO/2016/129534
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a method for manufacturing, using a plating treatment, a deposition mask in which a through-hole having a complicated shape is formed. This method for manufacturing a deposition mask includes: a first film-forming step for forming, on a substrate having insulating properties, a first metal layer that is provided with a first opening in a predetermined pattern; and a second film-forming step for forming, on the first metal layer, a second metal layer that is provided with a second opening connected to the first opening. The second film-forming step includes: a resist forming step for forming a resist pattern on the substrate and the first metal layer so as to leave a predetermined gap; and a plating treatment step for depositing the second metal layer on the first metal layer in the resist pattern gap. The resist forming step is carried out such that the first opening in the first metal layer is covered by the resist pattern, and such that the gap in the resist pattern is located on the first metal layer.

Inventors:
IKENAGA CHIKAO (JP)
Application Number:
PCT/JP2016/053581
Publication Date:
August 18, 2016
Filing Date:
February 05, 2016
Export Citation:
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Assignee:
DAINIPPON PRINTING CO LTD (JP)
International Classes:
C23C14/04; C25D1/08; H01L51/50; H05B33/10
Foreign References:
JP2009054512A2009-03-12
JP2005154879A2005-06-16
JP2003045657A2003-02-14
JP2014122384A2014-07-03
Attorney, Agent or Firm:
NAGAI Hiroshi et al. (JP)
Hiroyuki Nagai (JP)
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