Title:
電力変換装置の製造方法
Document Type and Number:
Japanese Patent JP6969333
Kind Code:
B2
Abstract:
To provide a power conversion device that is able to reduce manufacturing costs while ensuring heat dissipation of a semiconductor module and to provide its manufacturing method.SOLUTION: A power conversion device 1 comprises: a semiconductor layered unit 2 formed by layering semiconductor modules 21 and cooling pipes 22; a pressurizing member 3 disposed at one end, in a layering direction X, of the semiconductor layered unit 2 and that elastically pressurizes the semiconductor layering unit 2 in the layering direction X; a housing 4 accommodating the semiconductor layering unit 2 and the pressurizing member 3; and a bearing body 5 interposed between a bearing wall 41 and the pressurizing member 3, which are provided in the housing 4. The pressing member 3 has: a pressing part 31 that presses the semiconductor lamination unit 2; and a pair of to-be-born parts 32 formed on both sides of the pressing part 31. Each bearing body 5 is separately provided between corresponding one of the pair of to-be-born parts 32 and the bearing wall 41. Each bearing body 5 is formed by stacking a plurality of bearing blocks 50 in the layering direction X.SELECTED DRAWING: Figure 1
Inventors:
Tachibana Hideaki
Application Number:
JP2017232898A
Publication Date:
November 24, 2021
Filing Date:
December 04, 2017
Export Citation:
Assignee:
株式会社デンソー
International Classes:
H02M7/48
Domestic Patent References:
| JP2013162541A | ||||
| JP200038734A | ||||
| JP201659238A | ||||
| JP201629693A | ||||
| JP846241A |
Attorney, Agent or Firm:
Patent Business Corporation Aichi International Patent Office