Title:
強化ウエハ研磨パッドの製造方法および同パッドを実装した装置
Document Type and Number:
Japanese Patent JP2004524676
Kind Code:
A
Abstract:
As one of many embodiments of the present invention, a seamless polishing apparatus for utilization in chemical mechanical polishing is provided. The seamless polishing apparatus includes a polishing pad (156) where the polishing pad (156) is shaped like a belt and has no seams. The seamless polishing apparatus also includes a base belt (157) where the base belt (157) includes a reinforcement layer (182) and a cushioning layer (184). In addition, the cushioning layer (184) is an intermediary layer between the polishing belt pad (156) and the base belt (157).
Inventors:
Shu Kang Shan
Chao Engene Wai.
Dai Feng
Chao Engene Wai.
Dai Feng
Application Number:
JP2002552714A
Publication Date:
August 12, 2004
Filing Date:
December 07, 2001
Export Citation:
Assignee:
LAM RESEARCH CORPORATION
International Classes:
B24B37/22; B24B37/26; B24D11/00; B24D18/00; H01L21/304; (IPC1-7): H01L21/304; B24B37/00
Attorney, Agent or Firm:
Meisei International Patent Office