Title:
SEMICONDUCTOR DEVICE, SEMICONDUCTOR UNIT, AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JP2022041268
Kind Code:
A
Abstract:
To easily and visually recognize a mounting state of a semiconductor device to a wiring substrate.SOLUTION: A semiconductor device 1C includes a substrate 10 formed of a semiconductor material, a semiconductor element 40 mounted on the substrate 10, and a plurality of terminals 33 formed on a substrate rear face of the substrate 10. At an outer periphery part of the substrate 10, there are provided inclined faces 73 and 74 which incline toward an outer periphery edge of the substrate 10 as approaching to a substrate main face 10s from the substrate rear face. Each of the plurality of terminals 33 is formed across a region from the substrate rear face to the inclined faces 73 and 74.SELECTED DRAWING: Figure 45
Inventors:
NAKAYA GORO
TADA YOSHIHIRO
YAMAMOTO ISAO
TADA YOSHIHIRO
YAMAMOTO ISAO
Application Number:
JP2020146370A
Publication Date:
March 11, 2022
Filing Date:
August 31, 2020
Export Citation:
Assignee:
ROHM CO LTD
International Classes:
H01L33/62; H01L23/12; H01L25/10; H01L31/12; H01L33/00; H01S5/022
Attorney, Agent or Firm:
Makoto Onda
Hironobu Onda
Hironobu Onda