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Title:
MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE
Document Type and Number:
Japanese Patent JPS51144581
Kind Code:
A
Abstract:
PURPOSE:A semiconductor device,s manufacturing method according to a lift-off method, capable of certainly and adhesively forming a pattern of metallic film with a great thickness.

Inventors:
KUMABE HISAO
NAKATANI MASAAKI
HATSUHARA TOSHIHIKO
MIKI HIDEJIROU
Application Number:
JP6893575A
Publication Date:
December 11, 1976
Filing Date:
June 06, 1975
Export Citation:
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Assignee:
MITSUBISHI ELECTRIC CORP
International Classes:
H01L21/306; H01L21/302; (IPC1-7): H01L21/302
Domestic Patent References:
JPS4979490A1974-07-31
JP44007658A



 
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