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Title:
半導体装置の製造方法
Document Type and Number:
Japanese Patent JP4868840
Kind Code:
B2
Abstract:
A chemical mechanical polishing method comprises polishing an organic film using a slurry including polymer particles having a surface functional group and a water-soluble polymer.

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Inventors:
Yuki Kuda
Noki Matsui
Atsushi Shigeta
Shinichi Hirasawa
Hirokazu Kato
Masako Kinoshita
Nishioka
Hiroyuki Yano
Application Number:
JP2005345790A
Publication Date:
February 01, 2012
Filing Date:
November 30, 2005
Export Citation:
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Assignee:
JSR CORPORATION
Toshiba Corporation
International Classes:
H01L21/304; B24B37/00
Domestic Patent References:
JP2004152997A
JP2004363191A
JP2004335978A
JP200345964A
JP2004296955A
Attorney, Agent or Firm:
Mitsue Obuchi
Yukio Fuse



 
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