Title:
MANUFACTURING METHOD OF SEMICONDUCTOR ELEMENT
Document Type and Number:
Japanese Patent JPS5230173
Kind Code:
A
Abstract:
PURPOSE:To obtain a semiconductor element by etching of the semiconductor wafer to enable desired PN junction with effective planity even for a semiconductor wafer of bad parallelism.
Inventors:
IGARASHI YUKIO
Application Number:
JP10616275A
Publication Date:
March 07, 1977
Filing Date:
September 02, 1975
Export Citation:
Assignee:
TOKYO SHIBAURA ELECTRIC CO
International Classes:
H01L21/306; H01L21/302; H01L21/308; (IPC1-7): H01L21/302