Title:
MANUFACTURING METHOD OF SEMICONDUCTOR LIGHT EMITTING DEVICE
Document Type and Number:
Japanese Patent JP3407730
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To manufacture easily a variable wavelength semiconductor light emitting device which is excellent in mass productivity.
SOLUTION: A fluorescent substance chip (3) having a substrate (1) formed out of a thermoplastic resin and having a fluorescent substance layer (2) formed on the substrate (1) is prepared to provide the fluorescent substance chip (3) on a supporting member (6), and a light emitting semiconductor chip (5) is provided on the fluorescent substance chip (3). Thereafter, the substrate (1) is heated to bond to the supporting member (6) by fusion of the substrate (1) the fluorescent substance layer (2) and the light emitting semiconductor chip (5) of the fluorescent substance chip (3). Since the fluorescent substance chip (3) is previously formed, the quantity and density of the fluorescent substance in the fluorescent substance chip (3) are made uniform to make uniform the luminescent color of the semiconductor light emitting device.
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Inventors:
Takeshi Sano
Koji Tsukagoshi
Koji Tsukagoshi
Application Number:
JP2000336383A
Publication Date:
May 19, 2003
Filing Date:
November 02, 2000
Export Citation:
Assignee:
Sanken Electric Co., Ltd.
International Classes:
H01L23/28; H01L21/52; H01L33/32; H01L33/50; H01L33/56; H01L33/62; (IPC1-7): H01L33/00; H01L21/52; H01L23/28
Domestic Patent References:
| JP2000228545A | ||||
| JP1168166A | ||||
| JP1168169A | ||||
| JP11233831A | ||||
| JP200136150A | ||||
| JP2001210874A |
Attorney, Agent or Firm:
Keiichi Shimizu