To obtain a material for electronic members for surface mounting, excellent in heat resistance when reflown during surface mounting, low in burr and excellent in formability, e.g. releasability.

This material for electronic members for surface mounting is composed of a resin composition, wherein the resin composition is composed of (A) 10 to 80 wt.% of polybutylene naphthalate resin, (B) 10 to 80 wt.% of polyethylene terephthalate resin, and (C) 10 to 50 wt.% of glass fibers.