To provide a material for insulating film having excellent electric properties, thermal properties and mechanical properties, a coating varnish for insulating film containing the same and insulating film and semiconductor device using the same.
The material for insulating film contains a copolymer that is obtained by reaction between a polyamide having a specific structure and a reactive oligomer as a film-forming component. The coating varnish for insulating film includes the material and an organic solvent. The insulating film layer mainly comprises polybenzoxazole obtained by the condensation reaction and crosslinking reaction of the varnish with heat having micropores bored. The insulating film is used for an interlayer insulating film for a multilayer interconnection and/or a semiconductor device having a surface-protection layer.
SAITO HIDENORI
ENOKI HISAFUMI
