Title:
MEASUREMENT APPARATUS AND METHOD FOR DETERMINING SUBSTRATE GRID
Document Type and Number:
Japanese Patent JP2023024511
Kind Code:
A
Abstract:
To provide a measurement apparatus (10) and method for determining a substrate grid describing a deformation of a substrate (12) prior to exposure of the substrate (12) in a lithographic apparatus (LA) configured to fabricate one or more features on the substrate (12).SOLUTION: Position data for a plurality of first features and/or a plurality of second features on a substrate (12) is obtained. Asymmetry data for at least a feature of the plurality of first features and/or the plurality of second features is obtained. A substrate grid based on the position data and the asymmetry data is determined. The substrate grid and asymmetry data are passed to the lithographic apparatus LA for controlling at least part of an exposure process to fabricate one or more features on the substrate (12).SELECTED DRAWING: Figure 4
Inventors:
Businessen, Franciscus, Godefridus, Casper
Halse Boss, Ed, Maria
Megens, Henricus, Johannes, Lambertas
Soha, Robert, John
Tsang, Yupin
Halse Boss, Ed, Maria
Megens, Henricus, Johannes, Lambertas
Soha, Robert, John
Tsang, Yupin
Application Number:
JP2022194951A
Publication Date:
February 16, 2023
Filing Date:
December 06, 2022
Export Citation:
Assignee:
ASM L Netherlands B.V.
International Classes:
G01B15/00; G03F9/00; G06N20/00
Attorney, Agent or Firm:
Yoshiyuki Inaba
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito
Toshifumi Onuki
Akihiko Eguchi
Kazuhiko Naito