Title:
測定器及びシースの厚さを求める方法
Document Type and Number:
Japanese Patent JP7394711
Kind Code:
B2
Abstract:
A measuring device includes a substrate disposed on a substrate support of a plasma processing apparatus, a transmission circuit, a transmitting antenna, a receiving antenna, a reception demodulation circuit, and a calculator which are provided in the substrate. The transmission circuit generates a microwave. The transmitting antenna transmits the microwave generated by the transmission circuit as a transmission wave. The receiving antenna receives a reflected wave of the transmission wave by plasma above the substrate support as at least one reception wave. The reception demodulation circuit generates a signal that reflects a thickness of a sheath between the substrate and the plasma, from the reception wave. The calculator obtains the thickness of the sheath from the signal generated by the reception demodulation circuit.
Inventors:
Shinji Kubota
Application Number:
JP2020107803A
Publication Date:
December 08, 2023
Filing Date:
June 23, 2020
Export Citation:
Assignee:
東京エレクトロン株式会社
International Classes:
H05H1/00; H05H1/46
Domestic Patent References:
| JP2017188236A | ||||
| JP2012043572A | ||||
| JP10154600A | ||||
| JP11317299A |
Foreign References:
| US6181069 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshiki Kuroki
Junji Kashiwaoka
Yoshiki Kuroki
Junji Kashiwaoka