PURPOSE: To make it possible to conduct a measurement equal to that after package sealing by a method wherein the surface of a semiconductor device is coated with a dielectric film having a specific dielectric constant.

CONSTITUTION: When the photoresist layer 20, which is used to form an aperture part 22 on an insulating layer 16 and a passivation layer 18, is left on a semiconductor substrate 10 in the state as it is, the surface of the semiconductor integrated device is coated with a dielectric film having the dielectric constant of 1 or higher. As a result semiconductor chip is closely resembled to the capacitance between conductive leads in the state after the semiconductor chip is subjected to package-sealing, and an electric measurement equal to the state after package-sealed can be conducted in the substrate state.