MEASURING METHOD, MEASURING SYSTEM, AND NON-TRANSITORY COMPUTER-READABLE MEDIUM

Japanese Patent JP2023014480

A

To provide a measuring system and the like that enable the selection of an appropriate new measurement target by performing measurement for a limited number of measurement points.SOLUTION: A system includes a measuring tool and a computer system that communicates with the measuring tool. The computer system calculates (C) in-plane distribution of feature quantities on a wafer based on the feature quantities of a plurality of places on the wafer received from the measuring tool, selects (D) a new measurement point for obtaining the feature quantities based on the calculated in-plane distribution, calculates (F) new in-plane distribution of feature quantities on the wafer based on a feature quantity obtained by measurement (E) of the selected new measurement point, and outputs (H) at least one of the feature quantity of the new measurement point and the in-plane distribution, obtained by performing the selection of the new measurement point and the calculation of the new in-plane distribution at least once.SELECTED DRAWING: Figure 2

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FUKUDA HIROSHI

JP2021118433A

January 31, 2023

July 19, 2021

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HITACHI HIGH TECH CORP

G01B15/00; H01L21/66

Patent Attorney Corporation Hiraki International Patent Office
Inoue

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