Title:
力学量センサ
Document Type and Number:
Japanese Patent JP4165360
Kind Code:
B2
Abstract:
Dynamic value sensor has a sensor circuit board (10) with a moving element (13) on one surface and a silicon layer (14) on the other surface, with the two separated by an insulation layer (15). The moving section is displaced by application of a movement resultant force. The sensor has a switching circuit board (20) that is connected to the sensor circuit board and overlies a hollow section (30) above the moving element. Sensor and switching circuit boards are bonded together via a bonding section (40) that serves to enclose and seal the hollow section.
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Inventors:
Tetsuo Fujii
Application Number:
JP2003348253A
Publication Date:
October 15, 2008
Filing Date:
October 07, 2003
Export Citation:
Assignee:
株式会社デンソー
International Classes:
G01P3/44; G01P15/08; G01P1/02; G01P15/125; H01L29/84
Domestic Patent References:
| JP2001133479A | ||||
| JP11094506A | ||||
| JP2001235485A |
Attorney, Agent or Firm:
Yoji Ito
Takahiro Miura
Fumihiro Mizuno
Takahiro Miura
Fumihiro Mizuno