To attain adjustment of warpage of a thermal head by a simple structure.
The mechanism for adjusting warpage of a thermal head 1 includes a first adjustment screw hole 2 formed in a head mount base 10; a second adjustment screw hole 3 formed in a heat support member 11, the second adjustment screw hole being arranged coaxially with the first adjustment screw hole 2 and extending through in the thickness direction; and a set screw-like screw member 4 having a first thread portion to be screwed to the first adjustment screw hole 2 and a second thread portion to be screwed to the second adjustment screw hole 3, which are formed at both ends of a shaft. The screw member 4 is formed so that the thread ridge of the first thread portion and the thread ridge of the second thread portion formed on the outer periphery of the thread member 4 are reversed pitch helixes, and the outside diameter of the first thread portion and the inside diameter of the first adjustment screw hole 2 are formed to be smaller than the outside diameter of the second thread portion and the inside diameter of the second adjustment screw hole 3.
Takashi Ito
Yoshimi Hatanaka
Naoko Okura
Fumari Tamari
Takeyuki Suzuki