MEMS PACKAGE AND MANUFACTURING METHOD THEREFOR

Japanese Patent JP2008221450

A

To provide a manufacturing method for a MEMS package, which prevents dust adhesion after a hollowing process, and preventing breakage or the like during a manufacturing process.

The manufacturing method for the MEMS package having a MEMS element in a hollow structure includes: a process for preparing a MEMS board; a process for forming a sacrificial layer on the MEMS board; a process for forming the MEMS element connected to the MEMS board and extended over the sacrificial layer; a board jointing process for jointing a cover board for covering the MEMS element on the MEMS board; a hollowing process for hollowing the MEMS element by removing the sacrificial layer; and a sealing process for sealing a passage.

WO/2009/004547	PRODUCTION PROCESS OF A MICRO/NANO-FLUIDIC DEVICE HAVING AT LEAST ONE CHANNEL WITH A SECTION OF MICRO/NANO -METRIC SIZE
WO/2010/136815	SELF-DEFORMABLE MIRRORS AND THE SUPPORT THEREOF
WO/2022/001029	CAPACITIVE PRESSURE SENSOR AND METHOD FOR MANUFACTURING SAME

FUJII YOSHIO
OGAWA SHINPEI
YOKOYAMA YOSHINORI
ENDO KAZUYO

JP2007067728A

September 25, 2008

March 16, 2007

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MITSUBISHI ELECTRIC CORP

B81C1/00; B81B7/02

Takuji Yamada
Mitsuo Tanaka
Haruo Nakano

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