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Patent Searching and Data


Title:
SYSTEM DEVICE FOR INTEGRATING MATED PART WITH MOLDING PART
Document Type and Number:
Japanese Patent JP2008221453
Kind Code:
A
Abstract:

To provide a system device integrating a steel plate part with a mated part by supplying the mated part, while adapting it to a plurality of kinds of molding parts delivered from a part molding device.

This system device is constituted of: a part molding die device 5 which delivers the plurality kinds of molding parts 1A, 1B; detecting devices 16A, 16B which detect the kinds of the molding parts 1A, 1B to generate identification signals; a selective supply device 8 which selects and supplies the mated parts 7A, 7B adapted to the predetermined molding parts 1A, 1B by the identification signals from the detecting devices 16A, 16B; and an integrating process device 6 which integrates the mated parts 7A, 7B from the selective supply device 8 with the molding parts 1A, 1B.


Inventors:
AOYAMA YOSHITAKA
AOYAMA SHOJI
Application Number:
JP2007104301A
Publication Date:
September 25, 2008
Filing Date:
March 13, 2007
Export Citation:
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Assignee:
AOYAMA YOSHITAKA
International Classes:
B23P21/00; B23K11/14; B23K37/00; B30B13/00; B23K103/04