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Patent Searching and Data


Title:
MEMS SENSOR AND MANUFACTURING METHOD OF MEMS SENSOR
Document Type and Number:
Japanese Patent JP2010155299
Kind Code:
A
Abstract:

To uniform the thickness of a flexible part of an MEMS sensor.

The MEMS sensor has a laminated structure in which a support part, a spindle part, and a flexible part for connecting the support part to the spindle part to be deformed in accordance with a movement of the spindle part, are formed. The laminated structure includes: a single crystal silicon layer 10 forming the flexible part and having a flat lower surface; and a CMP stopper layer 30 laminated on the single crystal silicon layer and different from the single crystal silicon layer. A lower surface of the stopper layer and a lower surface of the single crystal silicon layer are included in the same plane, or the lower surface of the stopper layer is protruded from the single crystal silicon layer.

COPYRIGHT: (C)2010,JPO&INPIT


Inventors:
HATTORI ATSUO
Application Number:
JP2008333986A
Publication Date:
July 15, 2010
Filing Date:
December 26, 2008
Export Citation:
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Assignee:
YAMAHA CORP
International Classes:
B81B3/00; B81C1/00; G01C19/56; G01P15/12; G01P15/18; H01L21/304; H01L29/84
Attorney, Agent or Firm:
Dai Yoshida
Wataru Iwakami