To provide a method and apparatus for resin coating, with which waviness and warp of a workpiece is appropriately removed, and the ground workpiece is formed to be flat.
A wafer 1 containing waviness and warp is mounted on a liquefied resin P1, and then it is pressed against the resin P1 by a pressing pad 23. Then, the wafer 1 is sucked to and held on a suction part 24 of the pressing pad 23. The wafer 1 is raised to a position corresponding to a deforming element together with the pressing pad 23. After deformation for restoring the warp or the like on the wafer 1 is caused at this stage, the pressing pad 23 is released from the wafer 1, and then the resin P1 is hardened. A flat wafer 1 is obtained after the grinding by causing the pressed wafer 1 to fully deform on the resin P1.
COPYRIGHT: (C)2010,JPO&INPIT
ONODERA HIROSHI
SHIMOTANI MAKOTO
| JPH0866850A | 1996-03-12 | |||
| JP2006263837A | 2006-10-05 | |||
| JP2001110765A | 2001-04-20 | |||
| JP2007134371A | 2007-05-31 | |||
| JPH11111653A | 1999-04-23 | |||
| JP2000005982A | 2000-01-11 | |||
| JPH0866850A | 1996-03-12 | |||
| JP2006263837A | 2006-10-05 | |||
| JP2001110765A | 2001-04-20 | |||
| JP2006222119A | 2006-08-24 | |||
| JP2009148866A | 2009-07-09 |
Next Patent: MEMS SENSOR AND MANUFACTURING METHOD OF MEMS SENSOR