Title:
MEMS SENSOR, AND METHOD OF MANUFACTURING MEMS SENSOR
Document Type and Number:
Japanese Patent JP2010147268
Kind Code:
A
Abstract:
To provide an MEMS sensor which hardly fractures and has superior shock resistance performance when a flexible portion deforms.
The MEMS sensor includes: a support portion; the flexible portion which is a flexible film having one end coupled to the support portion and has a thick part and a thin part which has a gradual decrease section, a border between the thick part and the thin part being defined as an end of the section, thickness of the gradual decrease section decreasing as getting away from the thick part; and a strain detecting means formed at the thin portion to detect strain generated at the thin portion.
COPYRIGHT: (C)2010,JPO&INPIT
Inventors:
HATTORI ATSUO
Application Number:
JP2008323357A
Publication Date:
July 01, 2010
Filing Date:
December 19, 2008
Export Citation:
Assignee:
YAMAHA CORP
International Classes:
H01L29/84; B81B3/00; G01C19/56; G01P15/12; G01P15/18
Attorney, Agent or Firm:
Dai Yoshida
Wataru Iwakami
Wataru Iwakami