Title:
METAL BASE PRINTED WIRING BOARD, METAL BASE MULTILAYERED PRINTED WIRING BOARD AND MANUFACTURE THEREOF
Document Type and Number:
Japanese Patent JP3514669
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a metal base multilayered printed wiring board by using a solder heat resistant thermoplastic insulating layer that can be thermally bonded to a conductor foil and a metal base at a relatively low temperature, and yet can surely accomplish integral bonding.
SOLUTION: This metal base multilayered printed wiring board is formed by preparing a thermally bondable film 10 for interlayer connection of a layered electrical circuit by opening holes 8 that penetrate both faces of a filmy insulator 7 and filling these holes with a conductive paste 9, and forming a filmy wiring board 6 by thermally bonding a conductor foil and providing printed circuits 11 on both faces of the film 10, then thermally bonding the filmy wiring board 6 on one or both faces of a metal board 4 via an insulating layer 5. In the multilayered printed wiring board, the heat quantity of crystal fusion ΔHm and the heat quantity of crystallization ΔHc that is generated by crystallization during temperature rise, of a thermoplastic resin composition constituting the insulating layer 5 and the thermally bonded filmy wiring board, having characteristics that satisfy a relation given by the expression {(ΔHm-ΔHc)/ΔHm}≤0.5 is thermally bonded so as to satisfy a relation {(ΔHm-ΔHc)/ΔHm}≥0.7.
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Inventors:
Yamada, Shingetsu
Takagi, Jun
Taniguchi, Koichiro
Miyake, Toshihiro
Totani, Makoto
Takagi, Jun
Taniguchi, Koichiro
Miyake, Toshihiro
Totani, Makoto
Application Number:
JP18609299A
Publication Date:
March 31, 2004
Filing Date:
June 30, 1999
Export Citation:
Assignee:
MITSUBISHI PLASTICS IND LTD
DENSO CORP
DENSO CORP
International Classes:
H05K1/05; C08L71/10; C08L73/00; C08L79/08; H05K1/03; H05K3/38; H05K3/44; H05K3/46; (IPC1-7): H05K1/05; C08L71/10; C08L73/00; C08L79/08; H05K3/38; H05K3/46
Attorney, Agent or Firm:
鎌田 文二 （外２名）