Title:
COVERLAY FILM
Document Type and Number:
Japanese Patent JP3514668
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a coverlay film which is used for protecting a conductor circuit provided in a printed wiring board, excellent in thermal resistance, high in adhesion to a printed wiring board at a low heating temperature of 260°C or below, effectively bonded to the printed wiring board at a low temperature in a short time, and excellent in insulating properties.
SOLUTION: A coverlay film for protecting a conductor circuit provided in a printed wiring board is formed of thermoplastic resin composition which contains 65 to 35 wt.% polyarylketone resin and 35 to 65 wt.% amorphous polyether imide resin, the glass transition temperature of the thermoplastic resin composition measured through a differential scanning calorimetry at a rise in temperature is 150 to 230°C, and the characteristics of the resin composition are so set as to satisfy a formula, [(ΔHm-ΔHc)/ΔHm]≤0.5, where ΔHm represents the heat quantity of crystal fusion, and ΔHc denotes the heat quantity of crystallization generated by crystallization at a rise in temperature.
Inventors:
Yamada, Shingetsu
Takagi, Jun
Taniguchi, Koichiro
Nomoto, Kaoru
Miyake, Toshihiro
Takagaki, Takashige
Takagi, Jun
Taniguchi, Koichiro
Nomoto, Kaoru
Miyake, Toshihiro
Takagaki, Takashige
Application Number:
JP18601499A
Publication Date:
March 31, 2004
Filing Date:
June 30, 1999
Export Citation:
Assignee:
MITSUBISHI PLASTICS IND LTD
DENSO CORP
DENSO CORP
International Classes:
H05K3/28; C08J5/18; C08L71/10; C08L73/00; C08L79/08; C09J7/02; C09J171/10; (IPC1-7): H05K3/28; C08J5/18; C08L71/10; C08L73/00; C08L79/08; C09J7/02
Attorney, Agent or Firm:
鎌田 文二 （外２名）