Title:
METAL FITTING MOUNTING STRUCTURE FOR PRINTED-WIRING BOARD
Document Type and Number:
Japanese Patent JP3941593
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To decrease an occupied area of a metal fitting for grounding in the area of a printed-wiring board inner than a frame thereof when the metal fitting such as the metal fitting for grounding is mounted on the printed-wiring board containing a frame portion where no circuit component is mounted.
SOLUTION: In the printed-wiring board 1, there is provided a soldering pattern for soldering the metal fitting 5 for grounding to the printed-wiring board 1. Further, circular positioning holes 3 are formed in a master board 2. When the metal fitting 5 for grounding is mounted on the printed-wiring board 1, a soldering portion 8 is soldered to the soldering pattern in the printed-wiring board 1 with positioning projections of the metal fitting 5 for grounding inserted into the positioning holes 3 of the master board 2.
Inventors:
Nobuhiro Tamura
Application Number:
JP2002162042A
Publication Date:
July 04, 2007
Filing Date:
June 03, 2002
Export Citation:
Assignee:
NEC
International Classes:
H05K1/02; (IPC1-7): H05K1/02
Domestic Patent References:
| JP62184683U | ||||
| JP5006712U | ||||
| JP59083069U | ||||
| JP62134271U |
Attorney, Agent or Firm:
Masahiko Desk
Naoki Shimosaka
Yasuhisa Tanizawa
Naoki Shimosaka
Yasuhisa Tanizawa
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