Title:
METAL FOIL WITH RESIN AND WIRING BOARD USING THE METAL FOIL
Document Type and Number:
Japanese Patent JP2002264255
Kind Code:
A
Abstract:
To provide a metal foil with a resin which does not impair the physical property of a heat-resistant resin film, with a generated gas restrained to a low level during thermal processing and shows a solid adhesion between the heat-resistant resin film and a metal plating foil as well as a wiring board using the metal foil with a resin.
The metal foil with a resin is structured of a polyimide precursor composed mainly of aromatic tetracarboxylic acid dianhydride and siloxane diamine applied at least to one of the sides of the heat-resistant resin film and further, a metal plating layer laminated on the polyimide precursor. Also the wiring board using the metal foil is provided.
Inventors:
YOKURA MITSUYOSHI
OBAYASHI GENTARO
KOKUNI MASAHIRO
OBAYASHI GENTARO
KOKUNI MASAHIRO
Application Number:
JP2001063636A
Publication Date:
September 18, 2002
Filing Date:
March 07, 2001
Export Citation:
Assignee:
TORAY INDUSTRIES
International Classes:
C08J7/04; B32B15/08; B32B15/088; B32B27/34; C08G73/10; C23C18/16; C23C18/20; H05K1/03; H05K3/00; H05K3/06; H05K3/18; (IPC1-7): B32B15/08; B32B27/34; C08G73/10; C08J7/04; H05K1/03; H05K3/00; H05K3/06; H05K3/18