Title:
金属箔溶接方法、金属箔溶接装置、および可撓性樹脂金属箔積層体製造装置
Document Type and Number:
Japanese Patent JP4874214
Kind Code:
B2
More Like This:
JP5853849 | Laser welding method and engine manufacturing method |
JP5601778 | Method for producing semiconductor wafer |
JP2014083589 | THERMALLY WORKING MACHINE |
Inventors:
Hidetaka Shimizu
Kiyotaka Suzuki
Takatoshi Ishikawa
Terumasa Kanai
Kiyotaka Suzuki
Takatoshi Ishikawa
Terumasa Kanai
Application Number:
JP2007292636A
Publication Date:
February 15, 2012
Filing Date:
November 09, 2007
Export Citation:
Assignee:
Noritake Company Limited
International Classes:
B23K26/60; B23K26/14; B23K26/21; B23K26/70; B23K101/16; B23K103/16
Domestic Patent References:
JP2004167567A | ||||
JP4185761A | ||||
JP5293570A | ||||
JP2003064413A | ||||
JP62019771U | ||||
JP5131284A | ||||
JP7266069A | ||||
JP2001347384A | ||||
JP2004130360A | ||||
JP2004148374A | ||||
JP2004322125A | ||||
JP2007216275A |
Attorney, Agent or Firm:
Haruyuki Ikeda
Kojiro Ikeda
Kojiro Ikeda