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Title:
METAL MATRIX COMPOSITE BODY
Document Type and Number:
Japanese Patent JP2000077584
Kind Code:
A
Abstract:

To provide a metal matrix composite body showing a low thermal expansion coefficient which matches that of AlN and Si by forming a reinforcing material from a recrystallized silicon carbide.

As the reinforcing material for a metal matrix composite body, a recrystallized silicon carbide (RSiC) of 5-40 vol.% porosity (2-30 vol.% is preferred) is used. The original material of the RSiC is SiC powder having 2-mode particle distribution, and one side is a particle 20 of relatively large particle size (about 100 μm) while the other side is a particle 21 of very small particle size which reaches micron range (particle size <1 μm), with the small particle 21 made to be confine in the gusset of the large particle 20. Then it is sintered at 2,200°C or higher in an inert gas atmosphere. Thus, it is manufactured with no contraction, without tightening of pores among large particles. With the use of different porosity, a thermal expansion coefficient is also adjusted very accurately.


Inventors:
SCHMITT THEODORE NICOLAS
Application Number:
JP300399A
Publication Date:
March 14, 2000
Filing Date:
January 08, 1999
Export Citation:
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Assignee:
ELECTROVAC
International Classes:
C04B41/88; C22C32/00; C22C47/00; C22C47/08; C22C47/12; C22C47/18; C22C49/02; H01L23/15; H01L23/373; (IPC1-7): H01L23/373; C04B41/88; C22C47/08; C22C49/02; C22C47/18
Attorney, Agent or Firm:
Toshio Yano (2 outside)