Title:
METAL MOLD, DIE ROLL AND ELECTROFORMED PRODUCT
Document Type and Number:
Japanese Patent JP2014058716
Kind Code:
A
Abstract:
To provide a metal mold and a die roll, which have good transferability to resin or films and good releasability from the resin and the films, and to provide an electroformed product.
A 20 μm - 10 mm thick amorphous electric nickel-phosphorus alloy plating film is formed, which includes nickel as a main component, 10 - 20 wt.% of phosphorus, 0.3 - 3.0 atm% of hydrogen, and unavoidable impurities. High-precision engraving is processed on the surface of the film, and then 10 μm or less thick Cr, DLC, or TiN is coated on the surface.
Inventors:
KUTSUNA HIROAKI
TAGUCHI JUNSHI
TAGUCHI JUNSHI
Application Number:
JP2012203878A
Publication Date:
April 03, 2014
Filing Date:
September 18, 2012
Export Citation:
Assignee:
NOMURA PLATING CO LTD
International Classes:
C23C28/02; B29C33/38; C23C28/00; C25D5/26; C25D7/00
Domestic Patent References:
JPH11269587A | 1999-10-05 | |||
JP2008246714A | 2008-10-16 | |||
JP2002079522A | 2002-03-19 | |||
JP2003138386A | 2003-05-14 | |||
JP2009087431A | 2009-04-23 |
Attorney, Agent or Firm:
Ryu Iwatani
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