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Patent Searching and Data


Title:
METAL MOLD, DIE ROLL AND ELECTROFORMED PRODUCT
Document Type and Number:
Japanese Patent JP2014058716
Kind Code:
A
Abstract:

To provide a metal mold and a die roll, which have good transferability to resin or films and good releasability from the resin and the films, and to provide an electroformed product.

A 20 μm - 10 mm thick amorphous electric nickel-phosphorus alloy plating film is formed, which includes nickel as a main component, 10 - 20 wt.% of phosphorus, 0.3 - 3.0 atm% of hydrogen, and unavoidable impurities. High-precision engraving is processed on the surface of the film, and then 10 μm or less thick Cr, DLC, or TiN is coated on the surface.


Inventors:
KUTSUNA HIROAKI
TAGUCHI JUNSHI
Application Number:
JP2012203878A
Publication Date:
April 03, 2014
Filing Date:
September 18, 2012
Export Citation:
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Assignee:
NOMURA PLATING CO LTD
International Classes:
C23C28/02; B29C33/38; C23C28/00; C25D5/26; C25D7/00
Domestic Patent References:
JPH11269587A1999-10-05
JP2008246714A2008-10-16
JP2002079522A2002-03-19
JP2003138386A2003-05-14
JP2009087431A2009-04-23
Attorney, Agent or Firm:
Ryu Iwatani