Title:
METAL NANOPARTICLE DISPERSION, METHOD OF PRODUCING METAL NANOPARTICLE DISPERSION AND BONDING METHOD
Document Type and Number:
Japanese Patent JP2014214357
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a metal nanoparticle dispersion that enables bonding at a low temperature (for example, 200°C or less) and can improve mechanical characteristics and electrical characteristics at the bonded portion.SOLUTION: A metal nanoparticle dispersion has a metal nanoparticle having a surface at least a part of which is coated with a 8C or more amine A and a dispersion medium for dispersing the metal nanoparticle. The dispersion medium includes an amine B being a 7C or less primary, secondary or tertiary amine and being a linear alkylamine or alkanolamine.
Inventors:
ENDO KEIICHI
MIYOSHI HIROMASA
HINOTSU TAKASHI
KURITA TORU
KONO YOSHIKO
MIYOSHI HIROMASA
HINOTSU TAKASHI
KURITA TORU
KONO YOSHIKO
Application Number:
JP2013093801A
Publication Date:
November 17, 2014
Filing Date:
April 26, 2013
Export Citation:
Assignee:
DOWA ELECTRONICS MATERIALS CO
International Classes:
B22F9/00; B22F1/0545; B22F1/102; H01B1/00; H01B1/22; H01B13/00; H01R43/00
Domestic Patent References:
| JP2008150701A | 2008-07-03 | |||
| JP2009161808A | 2009-07-23 |
Attorney, Agent or Firm:
Ani store Setsuo
Hitoshi Seino
Tomohiro Okuyama
Kazumasa Hashimura
Hitoshi Seino
Tomohiro Okuyama
Kazumasa Hashimura
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