Title:
METAL PASTE FOR JOINING, JOINT BODY, SEMICONDUCTOR DEVICE, AND METHOD FOR PRODUCING JOINT BODY
Document Type and Number:
Japanese Patent JP2021127506
Kind Code:
A
Abstract:
To provide a metal paste for joining that can ensure sufficient joint strength even when joining a member having gold at a bonding surface, and provide joint body and a semiconductor device, and a method for producing a joint body each of which uses the metal paste for joining.SOLUTION: A metal paste for joining has metal particles and a dispersion medium. The metal particles include copper particles and copper zinc alloy particles.SELECTED DRAWING: None
Inventors:
ISHIKAWA MASARU
NAKAKO TAKEO
KAWANA YUKI
NEGISHI MOTOHIRO
NATORI MICHIKO
SAKURAI KIWA
NAKAKO TAKEO
KAWANA YUKI
NEGISHI MOTOHIRO
NATORI MICHIKO
SAKURAI KIWA
Application Number:
JP2020023532A
Publication Date:
September 02, 2021
Filing Date:
February 14, 2020
Export Citation:
Assignee:
SHOWA DENKO MATERIALS CO LTD
International Classes:
B22F9/00; B22F1/00; B22F7/08; H01B1/22; H01L21/52
Attorney, Agent or Firm:
Yoshiki Hasegawa
Yoshinori Shimizu
Hiroyuki Hirano
Yoshinori Shimizu
Hiroyuki Hirano