To provide a metal plated film excellent in bending characteristics, folding characteristics and hinge characteristics extremely effective as a film circuit board such as a flexible circuit board, a tape circuit board, etc.

The metal plated film, wherein a seed layer and a Cu plating layer are successively provided at least on the one side of a resin film base material, is constituted of a laminated plating layer having a multilayered structure formed by combining a plurality of sets of Cu plating layers in a state that each of the Cu plating layers and an In plating layer are set to one set.